Accelerating Engineering from Semiconductors to AI Factories
Experience the Future of AI-Accelerated Engineering at SC26
AI is transforming engineering. From advanced semiconductors and high-speed interconnects to AI factories and digital twins, engineers face unprecedented design complexity, simulation scale, and performance demands.
At SC26, discover how Cadence combines accelerated computing, physics-based simulation, IP, agentic AI, and digital twin technology to help organizations design, optimize, and operate the next generation of intelligent systems. Built on the Cadence Millennium M2000 AI Supercomputer, powered by the NVIDIA Blackwell Platform, Cadence solutions enable engineers to solve problems that were previously impractical or impossible.
Visit Cadence at booth 6310, McCormick Place, Chicago, November 16-19, 2026.
Featured Demonstrations
- Hardware and Software: Cadence Millennium M2000 AI Supercomputer, powering GPU-accelerated design, simulation, and AI workloads
- IP: Cadence UALink IP, scaling fabrics for AI factories
- IP: Cadence HBM4E PHY @ 16Gbps, the fastest HBM4E for AI factories
- Software: Cadence Reality Digital Twin Platform, enabling the design, simulation, optimization, and operation of AI factories and data centers across power, cooling, networking, and workload infrastructure
Meet with Our Experts
Whether you are designing AI silicon, advanced packaging, next-generation interconnects, or large-scale AI infrastructure, Cadence can help accelerate innovation from concept to deployment. Visit booth 6310 or schedule a meeting with our experts at SC26.