Overview

Watch this recording to fully understand the thermal and stress challenges introduced by 3D-ICs, which are cross-fabric problems.  Learn how the Cadence Celsius™ Thermal Solver helps you solve this problem by producing thermal gradient for the whole system, enabling analysis from early design to signoff​. Takeaways:

• Seamless integration with Cadence’s OrbitIO™ Interconnect Designer and Voltus™ IC Power Integrity Solution
• Flexible thermal and stress analysis for TSV and 3D-IC planning
• High performance and accurate thermal and stress analysis for signoff