Design for AI and AI for Design

Cadence is advancing both sides of the AI supercycle—helping customers build the high-performance silicon needed for AI systems, while applying AI to accelerate chip design.

Visit our booth #827 to learn about:

• Agentic AI across chip, package, and board design:
  Discover how Cadence Agentic AI accelerates design workflows across chip, package, and board with greater automation, faster iteration, and improved design quality.
• Chiplet platforms for physical AI applications:
  Learn how Cadence enables modular chiplet-based design for next-generation physical AI systems with interoperable platforms and a standardized framework for scalable innovation.
• Accelerated Verification with Dynamic Duo III:
  Discover Cadence’s desktop emulation system for smaller-scale verification, delivering full compatibility with rack-based Palladium® Z3 and Protium™ X3 flows to accelerate complex HW/SW co-verification at a fraction of the deployment cost.

Meet Our Experts

Schedule time with Cadence experts for deeper discussions on our latest EDA tools, solutions, and workflows tailored to your engineering challenges.

Conference Program

Explore Cadence-led panels and technical papers at DAC for deeper insights into the latest advances in AI-driven design, chiplets, verification, and the future of EDA.