Where RF Meets AI: RF Design Solutions for the Next Wave of Wireless Innovation
Join Cadence in Booth #D25 at EuMW to see how integrated RF and microwave design, simulation, analysis, advanced packaging, and agentic AI workflows help accelerate development of advanced RFICs, MMICs, modules, antennas, and systems while reducing manual handoffs and improving first-pass success.
See how Cadence brings together RF-aware design environments, proven simulation engines, electromagnetic (EM) and thermal analysis, heterogeneous integration, and agentic AI workflows to help teams move from concept to realization faster.
- Learn how integrated RF design flows reduce data translation errors and manual rework for RFIC, MMIC, module, package, PCB, and system-level co-design
- See how in-design EM and thermal analysis with high-performance computing and GPU acceleration support large RF digital twins and shift-left workflows
- Discuss how Cadence AI can help improve RF engineering productivity and design throughput
- Leverage heterogeneous integration to connect RFICs, MMICs, chiplets, laminate substrates, packages, boards, and systems in integrated workflows that support cross-domain design, analysis, optimization, and verification from concept through signoff
Discuss your RF design challenges and learn how Cadence can help accelerate your next-generation wireless, aerospace, defense, automotive, and communications designs.